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Integrated Equipment Heatsink

This integrated heatsink for equipment combines an A6063 aluminum substrate with C1100 copper plate and fins for optimal thermal performance. The aluminum substrate features nickel plating, while the copper substrate is treated for anti-oxidation. With nickel-plated copper stamped fins and a heat pipe, this heatsink ensures efficient heat dissipation and durability, making it ideal for various industrial applications.
Availability:

Compact Mini Heat Sink for Tight Spaces
Compact Mini Heat Sink for Tight Spaces
Usage ScenariosIndustrial equipment, computer hardware, electronic instruments, medical devices, and high-performance computing systems
MaterialAluminum substrate A6063 + Copper plate C1100 + Copper fins C1100
Manufacturing ProcessAluminum substrate (nickel plating) + Copper substrate (anti-oxidation) + Copper stamped fins (nickel plating) + heat pipe + welding


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Integrated Equipment Heatsink